Tag Archives: Integrated Passive Devices

IPDiA and CEA-Leti Announce New Capacitance Density Target (1uF/mm2)

Utilizing 3D metal-insulator-metal capacitor structures, CEA-Leti and IPDiA (France) utilized their common lab arrangement to develop a new process based on depositing medium-K dielectrics to achieve capacitance densities of 550nF/mm2….

RF Micro Devices Expands Foundry Services To Include Integrated Passive Component Technology

RF Micro Devices, Inc., a global leader in the design and manufacture of high-performance radio frequency components and compound semiconductor technologies, announced May 17th 2010 that the Company has added…

AVX Says Embedded Capacitance Ready For Mass Production

According to Tom Zednicek and Radim Uher of AVX Czech Republic facility in Lanskroun- embedded ceramic capacitor technology has finally begun the important transition to mass production in printed circuit…

ON Semiconductor to Acquire California Micro Devices for Access To “Access To Integrated Passive Technology”

ON Semiconductor and California Micro Devices announced on December 14, 2009 the signing of a definitive merger agreement pursuant to which ON Semiconductor will acquire California Micro Devices (CMD) through…

Will Ceramic Chip Capacitors Sink Beneath The Surface?

By Tom Adams, Consultant; Sonoscan, Inc. The idea of embedding components, both active and passive, inside a printed circuit board is nearly as old as printed circuit boards themselves. One…

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