Intel Voices Concerns Over Quality of High Capacitance Ceramic Chip Capacitors:

Clive Hendricks of Intel Corporation raised concerns over the quality of high capacitance multilayered ceramic chip capacitors in his Keynote Speech at The Capacitor & Resistor Technology Symposium held in New Orleans, LA USA on March 16th, 2010.

Based upon research conducted at Intel Corporation (Chandler, AZ USA) by Yongki Min, Venkat Magadala and Tim Lane, the company has noted a disturbing trend with respect to the life expectancy of high capacitance MLCC in the 2.2 to 100 microfarad range. According to Clive Hendricks- “Up until recently, failure due to dielectric wear out was not a concern for the capacitors used to support CPUs,” in fact “our reliability models showed that the capacitors could be used for thousands of years before the insulation resistance would begin to degrade,” however, “in the past five years we have noticed a disturbing trend- as the capacitance density has increased, the usable life has reduced to hundreds, then tens and now even less than five years.”

Mr Hendricks also noted that “going forward, we see reduced reliability margins impacting capacitor supplier roadmaps and posing an increased risk for applications using decoupling MLCCs.”

The company noted that the method by which capacitance density of MLCC has increased- i.e. the stacking up of hundreds of layers of dielectric material between layers of base metal electrode has come at a cost. The trend to thinner dielectric layers has come with unwanted consequences- typically at the expense of rated voltage, and therefore it has adversely impacted the expected life of the MLCC in a circuit. The company further predicts that the MLCC industry faces keen challenges that will impede its ability to increase capacitance density while reducing rated voltage-going forward. Intel noted that X5R at 4 volt and X6S at 2.5 volt are as low as the industry will accept at this time. Intel believes that high-cap MLCC suppliers are caught in a “catch-22 situation”- to increase capacitance density they need to make thinner dielectric layers and to maintain reliability they need to reduce the grain size of the barium titanate dielectric material- which in turn will reduce the capacitance density. Intel concluded by stating that it was their opinion that the rate of progress in MLCC would be impeded going forward without a major breakthrough in the engineered materials or processing to manufacture MLCC.

Technology Changes in Ceramic Capacitance and MLCC Dielectric Layer Thickness

Technology Changes in Ceramic Capacitance and MLCC Dielectric Layer Thickness


Alternatives to High Capacitance MLCC are limited due to limited capacity to produce. Obviously both tantalum chip capacitors and solid polymer aluminum chip capacitors are viable alternatives to high-capacitance MLCC in the 2.2 to 100 microfarad arena, but the global capacity to produce these parts is quite limited when compared to the massive quantities of MLCC produced each year. Therefore, a breakthrough in ceramic materials and processing technology is necessary for MLCC technology to move forward to match the future requirements of CPU decoupling expected over the next 20 years.

Additional Resources: (1) Ceramic Capacitors: World Markets, Technologies & Opportunities: 2009-2014 ISBN # 1-893211-25-8 (December 2009) (2) BME MLCC: Global Markets, Technologies & Opportunities: 2005-2010 ISBN # 1-893211-74-6 (2005)

Taiyo Yuden Introduces World’s First 100μF in EIA 0805 Size Multilayer Ceramic Capacitor

Uses Advanced Materials Technology and Thin Layer Technology to Achieve Reduction by about 62% of the Company’s Previous Product Size…

Taiyo Yuden Co., Ltd. has announced the details of the commercial release of the “AMK212BJ107MG” (2.0×1.25×1.25mm), achieving an industry-leading capacitance of 100μF in an EIA 0805 size multilayer ceramic capacitor. It achieves the same capacitance and performance of the previous Taiyo Yuden model, the EIA 1206 size “AMK316BJ107ML” (3.2×1.6×1.6mm) in just 38% of the earlier volume. The product is optimum for IC power lines in smartphones and other high-performance mobile phones, and in notebook PCs, where steady demand for higher performance and expanded functions is coupled with demand for more compact size. With this release, the lineup of multilayer ceramic capacitors with 100μF capacitance has increased, with rated voltage up to 16V for the EIA 1210 size (3.2×2.5×2.5mm), to 6.3V for the EIA 1206 size, and to 4V for the EIA 0805 size. This lineup should encourage more product substitution away from electrolytic capacitors.

Furthermore, the product, together with compact, high-value products featuring 1μF capacitance in the EIA 0201 size and 10μF capacitance in the EIA 0402 size, shows that Taiyo Yuden is actively developing high-end multilayer ceramic capacitors.

Production will commence in March 2010 at the Company’s Tamamura Plant in Gunma Prefecture, Japan at an output pace of 1 million units per month. Sample price is 70 yen per unit.

Technology Background:

High-performance mobile phones such as smartphones, and notebook PCs, are becoming ever more compact with increased functions and higher performance. Moreover, such high performance and rich functions need to be incorporated into a limited chassis space. To this end, the high-value multilayer ceramic capacitor used for the power line also needs to be smaller while also maintaining high performance.

Ever since Taiyo Yuden’s commercialization of a nickel-electrode high-value multilayer ceramic capacitor in 1984, the company has advanced the materials technology of multilayer ceramic capacitors, thin layer technologies, and other technologies to promote ever more compact, higher-value capacitors. The “AMK212BJ107MG” is the latest product of this technology development, achieving as many as 800 layers stacked in a single ceramic capacitor.

Additional Resources: Ceramic Capacitors: World Markets, Technologies & Opportunities: 2009-2014 ISBN # 1-893211-25-8 (December 2009)

What’s the Hold-Up With The 220-Microfarad Ceramic Chip Capacitor?

A 220 microfarad capacitor has been promised by the ceramic capacitor industry for more then 2 years now, with a promise of it being 18 months away; with X5R prototypes being developed for mass production. However it is no mystery that the time frame for this development, so critical for the advancement of ceramic capacitor technology further into the electrolytic market segment (worth $7 billion USD). Key technology developments in high capacitance MLCC occurred in 1993, 1995 and 1998 with respect to capacitance value per cubic centimeter of dielectric; since then the additional developments have been in performance characteristics of the finished capacitors at various operating temperatures, voltages and frequencies; with technology focused on eliminating unwanted affects inherent in the ceramic. To that end, PCI Magazine posed the following question to our readers…

We patiently await the production of a 220-microfarad ceramic chip capacitor- why do you think such a product is taking so long to mass produce?

This question prompted a flurry of responses on the subject- 60% of respondents cited that technological hurdles with a 220 microfarad ceramic chip capacitor could not as of yet be overcome to justify its mass production. 25% said that a 220 microfarad MLCC was possible to produce today, but that the costs to produce, including raw materials, processing costs and low yield ratios are too expensive when compared to competing technologies in aluminum and tantalum technology. 15% of respondents noted that the total available market in the 220-microfarad “surface mount” portion of the electrolytic business was not large enough to justify the development costs.


Those that noted technical difficulties outlined come key technical hurdles associated with producing a 220 microfarad MLCC, with numerous respondents point toward the projected loss in effective capacitance when DC bias voltage is applied to such a part especially when packaged in a usable 1210 or 1206 (EIA) case size. Others noted the very poor voltage coefficient and alarming piezolectric parasitics of such a device. And that “Thinning the (ceramic) slip will make this already ghastly set of problems worse.” Others still pointed toward the mechanical instability of such a device, noting that so many layers in such a small device will result in a high degree of cracking. Those that believed such a device was possible to produce over time, noted that beyond the technical limitations was the bare fact that the current costs to produce for MLCC at such a high capacitance level would be too high to compete with the costs of alternative capacitor dielectrics, such as tantalum and aluminum, who ultimately have much higher yield ratios then would be possible in such a high layer count part. Respondents also noted that the total available market at 220 microfarad in a comparable part- a surface mount tantalum chip or a solid polymer aluminum capacitor- was too small to justify the investment in development costs.

Additional Resources: (1) Ceramic Capacitors: World Markets, Technologies & Opportunities: 2009-2014 ISBN # 1-893211-25-8 (December 2009) (2) (2) BME MLCC: Global Markets, Technologies & Opportunities: 2005-2010 ISBN # 1-893211-74-6 (2005)

USITC Institutes Section 337 Investigation On Ceramic Capacitors

The U.S. International Trade Commission (USITC) has voted to institute an investigation of certain ceramic capacitor and products containing same. The capacitors at issue in this investigation are a type of capacitor, used in a variety of electronic devices, in which one or more pairs of conductors are separated by a ceramic dielectric material.

The investigation is based on a complaint filed by Murata Manufacturing Co., Ltd., of Japan, and Murata Electronics North America, Inc., of Smyrna, GA, on October 1, 2009. A supplement to the complaint was filed on October 28, 2009. The complaint alleges violations of section 337 of the Tariff Act of 1930 in the importation into the United States and sale of certain ceramic capacitor and products containing same that infringe patents asserted by Murata. The complainant requests that the USITC issue an exclusion order and cease and desist orders.

The USITC has identified the following as respondents in this investigation: Samsung Electro-Mechanics Co., Ltd., of Korea; and Samsung Electro-Mechanics America, Inc., of Irvine, CA.

By instituting this investigation (337-TA-692), the USITC has not yet made any decision on the merits of the case. The USITC’s Chief Administrative Law Judge will assign the case to one of the USITC’s six administrative law judges (ALJ), who will schedule and hold an evidentiary hearing. The ALJ will make an initial determination as to whether there is a violation of section 337; that initial determination is expected before the end of the year.

Additional Resources: (1) Ceramic Capacitors: World Markets, Technologies & Opportunities: 2009-2014 ISBN # 1-893211-25-8 (December 2009) (2) BME MLCC: Global Markets, Technologies & Opportunities: 2005-2010 ISBN # 1-893211-74-6 (2005)

A Detailed Look At Murata’s ITC Complaint Against Samsung EMCO

ITC Complaint Claims Infringement On Methods for Lowering MLCC Inductance; Methods for Avoiding MLCC Cracking and De-lamination; and Methods for Avoiding Oxidation During Gas Firing of MLCC…

The law firm of Orrick, Herrington & Sutcliffe LLP of Washington, DC filed a complaint with the United States International Trade Commission (USITC) on behalf of Murata Manufacturing Company Limited of Kyoto, Japan and Murata Electronics North America of Smyrna, Georgia naming Samsung Electro-Mechanics Co., Ltd. Of Suwon City, Republic of Korea (SEMCO) and Samsung Electro-Mechanics America, Inc., of Irvine, California USA as the respondents. The law firm sent a letter of complaint on Murata’s behalf on October 1, 2009 to Marilyn R, Abbott, Secretary, USITC, requesting that the Commission conduct an investigation under section 337 of the Tariff Act of 1930, as amended regarding “Certain Ceramic Capacitors and Products Containing Same”

Specific Claims of Patent Infringement:According to the complaint, Murata alleges that SEMCO continues to unlawfully import into the U.S., sell for importation, and sell within the U.S. after importation certain ceramic capacitors and products containing ceramic capacitors which allegedly infringe upon Murata’s claims of U.S. Patent Nos. 6,266,229 (the ‘229 patent entitled “Multilayered Capacitor”); 6,014,309 (the ‘309 patent entitled “Laminated Ceramic Electronic Parts” covering both MLCC and chip varistors); 6,377,439 (the ‘439 patent entitled “Electronic Multilayer Ceramic Component”); and 6,243,254 (the ‘254 patent entitled “Dielectric Ceramic Composition and Laminated Ceramic Capacitor Using The Same”).
What Murata Is Seeking: Murata requests that, after an investigation by the USITC, the Commission issue an exclusion order pursuant to Section 337 (part d), that will prohibit the entry into the United States of SEMCO’s ceramic capacitors and products containing ceramic capacitors, and a cease and desist order pursuant to section 337 (part f) to preclude SEMCO from offering for sale, marketing, advertising, demonstrating, warehousing, selling and/or using such imported products in the United States. Murata is also expecting the ITC to determine if any damages have been realized as a result of the infringement upon completion of its investigation into the matter (Publisher’s Note: SEMCO does not break out sales by world region for any of its products in its financial data; and therefore it is not known how much in ceramic capacitor sales SEMCO does in the United States- however, United Nations Trade Data shows US imports of MLCC from South Korea at $26.7 million USD for the 2008 calendar year; but still, the claim is careful to point out that SEMCO manufactures MLCC in countries outside of Korea, and therefore its true MLCC revenues in the United States cannot be accurately determined through conventional research methods).
Details of the Alleged Patent Infringement: According to the complaint, three of Murata’s asserted patents relate specifically to multilayered ceramic chip capacitors and the fourth of Murata’s asserted patents relates to the raw material consumed in the manufacture of ceramic capacitors. Specifically, the complaint describes the asserted patents as follows: (i) “the ‘229 patent is generally directed to a multilayer capacitor that is better adapted for high frequency circuit applications because it can have a lower equivalent series inductance (ESL)”; (ii) “the ‘309 patent describes ceramic parts such as a multilayer ceramic capacitor or a multilayer ceramic varistor” and further describes “how to select characteristics of the internal electrodes and of the ceramic layers to avoid manufacturing and reliability problems”; (iii) “the ‘439 patent is directed to a multilayer ceramic component, such as a multilayer ceramic capacitor, which is less susceptible to cracking or de-lamination and has high thermal shock resistance and high reliability”; and (iv) “the ‘254 patent is directed to certain dielectric ceramic compositions and multilayer ceramic capacitors that use that ceramic as a dielectric and nickel as the electrode.” To summarize- Murata’s complaint focuses on methods for lowering the equivalent series inductance in an multilayered ceramic chip capacitor (MLCC); production methods for avoiding MLCC cracking and de-lamination; and the composition and volume of ceramic dielectric materials for use with nickel electrodes in an MLCC.

Corresponding Patents In Other Countries: The complaint also notes that the “229 patent” also has additional patents issued in Japan, Taiwan and Europe; while the “309 patent” has additional patents in the People’s Republic of China and in the Republic of Korea (the 309 patent was rejected in Japan); while the 439 patent has additional patents issued in the Republic of Korea, Taiwan, and in Malaysia (the 439 patent was also rejected in Japan); while the “254 patent” has additional foreign counterparts in Japan, Taiwan, the People’s Republic of China, the Republic of Korea, Germany and the United Kingdom.

The Specific Types of MLCC Noted In The Claim: Murata’s complaint also cites specific MLCC produced by SEMCO as being in violation of all or part of the four patents mentioned; including SEMCOs (EIA Case) 0402 0.1 microfarad, 10 Volt, in X7R dielectric (SEMCO Part Number CL05B104KP5NNNC), which is sold through distribution in the United States for $0.0025 a piece in quantities of 10,000; the (EIA Case) 0402 1.0 microfarad at 6.3 Volt in X6S dielectric (SEMCO Part Number CL05X105KQ5NNNC), which is sold through distribution in the United States for $0.70 a piece; and the (EIA Case) 1206 at 10 microfarad, 25 Volt in X7R dielectric, which sells through distribution in the United States for $0.0442 a piece in quantities of 2000 (SEMCO Part Number CL31B106KAHNNNE).

The Murata complaint also points out four specific SEMCO MLCC parts of the “low ESL type” in the CL01Y and the CL21Y series.

Claims of Infringement on the “229 Patent:” With respect to the claim of infringement upon Murata’s “229 patent” the case is offered up in the complaint that SEMCO parts CL01Y104MR5NJNB, CL01Y105MR5NJNB, CL21B104M05NJNB and CL21Y225MR5NJNB emulate in some form the specific electrode plate lead dimension and arrangement in the MLCC. The patent itself notes how careful control of the electrode plate with respect to length and width ratios limits the magnetic flux induced by current flow and therefore reduces the equivalent series inductance of the capacitor to desirable levels.

Claims of Infringement on the “309 Patent:” With respect to the claim of infringement upon Murata’s “309 patent” the case is offered up in the complaint that SEMCO part CL31B106KAHNNNE emulates in some form that by controlling the ratio of the thickness of the internal metal electrodes to the thickness of the corresponding ceramic dielectric material layer- suppression of layer de-lamination and component cracking can be achieved during the sintering process. Also, the claim is made in the patent that by controlling the ratio of the total volume of the internal electrode material to the total volume of the ceramic dielectric material in the finished component, added strength is given to the capacitor to help protect it against the adverse affects of thermal stress.

Claims of Infringement on the “439 Patent:” With respect to the claim of infringement upon Murata’s “439 patent” the case is offered up in the complaint that SEMCO part CL05X105KQ5NNNC emulate in some form that by controlling the ratio of the width of the side of the MLCC- between the side-gap region and the ends of the inner electrodes- and one of the side faces of the sintered ceramic block- to the width of the inner electrodes- reduces the capacitors susceptibility to cracking and de-lamination and helps to reduce the adverse affects of thermal shock.

Claims of Infringement on the “254 Patent:” With respect to the claim of infringement upon Murata’s “254 patent” the case is offered up in the complaint that multiple SEMCO MLCC infringe upon the asserted claims protected in the patent (the complaint references SEMCO part No. CL05B104KP5NNNC as a single example of multiple parts produced by SEMCO that infringe upon the claims in the “254” patent). This patent notes that by controlling the ratio of barium materials and titanium materials in the concentration of barium titanate ceramic, the affects of oxidation can be reduced during sintering of a capacitor body with nickel internal electrode in a gas stabilized kiln or furnace.

What Happens Next: Within 30 calendar days of the filing of the complaint the ITC Commissioners will vote on whether to begin an investigation into the Murata claim of patent infringement. The subject matter of the investigation and the parties involved are made public through notice of investigation in the United States Federal Register. In addition, all non-confidential documents filed with the ITC are made available to the public via the ITC’s Electronic Document Information System (EDIS), which can be accessed through the ITC’s Internet website: www.usitc.gov.

Publisher’s Note: Why This is An Important Case For The Industry: The decision as to whether or not the ITC will pursue this case, and any subsequent rulings made by the ITC in the matter of this case may have important and wide reaching implications for the ceramic capacitor industry and the passive electronic component industry worldwide. Any ruling made by the ITC is governed by the trade within the borders of the United States. However, a ruling by the ITC can be used as precedent in other courts in other countries, and therefore the listing of corresponding patents in other countries noted in the Murata claim should not be lost on the reader. PCI Magazine will continue to follow this case as it unfolds.

Samsung Electro-Mechanical: Outperforms In MLCC

Samsung continues to outperform the global passive electronic components market, showing only a slight downturn in comparison to its rivals in 2009-with an estimated 3% overall decline in quarter-to- quarter revenues brought on by a dismal January and February 2009 (Bouncing back in March). The company performed exceptionally well in all phases of operation compared to other vendors through December 2008; however, subsequently, loss of component sales volumes in the HDI business unit (down 21% quarter to quarter), and the CDS Business Unit (down 16% quarter to quarter) in January and February had a negative impact on revenues for the March quarter. The company has invested heavily in high capacitance MLCC solutions and it is now paying off in a bad economy. The low value of the won to the yen in 1Q 2009 continued to make price quotes from SEMCO much lower than that of the Japanese and the Chinese MLCC firms. The company continued to outperform in MLCC in the first quarter of 2009 (ending March for SEMCO), with revenues at 214 billion won; up 12.1 % quarter to quarter and 36% year over year. The company is on a run rate to sell 900 billion Won worth of MLCC in CY 2009.

Additional Resources For This Article: (1) (1) Ceramic Capacitors: World Markets, Technologies & Opportunities: 2009-2014 ISBN # 1-893211-25-8 (December 2009)