RF Micro Devices, Inc., a global leader in the design and manufacture of high-performance radio frequency components and compound semiconductor technologies, announced May 17th 2010 that the Company has added high power Integrated Passive Component (IPC) technology to RFMD’s foundry services portfolio and will begin providing IPC technology to customers of its Foundry Services business unit in June of this year. RFMD’s IPC technology provides all of the passive circuit components necessary to enable matching n e t w o r k s , i n c l u d i n g MIM capacitors, multi-layer stacked capacitors, thin-film resistors and inductors. Additionally, three metal interconnect layers are available for complex routing and increased current-handling capability.
Additional Resources: (1)
Integrated Passive Devices: World Markets: 2003-2008 ISBN # 1-893211-61-4 (2003) (2) Integrated Passive Devices: World Market Presentation 2006 (3) LTCC Components & Modules: World Markets, Technologies & Opportunities: 2002-2007 Technical-Economic Analysis ISBN # 1-893211-11-8 (2002).