Utilizing 3D metal-insulator-metal capacitor structures, CEA-Leti and IPDiA (France) utilized their common lab arrangement to develop a new process based on depositing medium-K dielectrics to achieve capacitance densities of 550nF/mm2.

CEA-Leti and IPDiA were funded under the PRIIM initiative (Platform for the Realization of shared Industrial Innovation) by OSEO to develop a process for increasing capacitance density on 3D structures. Atomic Layer Deposition (ALD) was utilized to achieve conformal coating in high aspect ratio geometries and control thicknesses at the atomic level. A capacitance density of 550nF/mm2 was achieved while keeping leakage and parasitic effects at levels similar to a lower density process previously demonstrated. They unveiled their results at the Device Packaging Conference in Scottsdale/Fountain Hills, Arizona (USA) in March 2012.

PICS (Passive Integration Connecting Substrate) high-density capacitors take advantage of increased surface area in the 3D structure without increasing the footprint of the capacitor. The demonstrated stability with regards to temperature, voltage, and aging in addition to reliability and low ESR/ESL makes the PICS technology an alternative to discrete components – especially in high reliability applications. Applications that can benefit from competitive performance in a smaller volume include: medical, harsh environments, automotive, communications, industrial, defense, and aerospace.

Intrinsic applications that can immediately benefit from these demonstrated improvements include DC/DC converter, IC decoupling, MEMS, integrated sensors, memory sticks, and smartcards. The next steps are to develop the technology for market deployment in next generation 3D products. IPDiA and CEA-Leti are continuing development with PICS as they seek to achieve 1uF/mm2.

Additional Resources:

IPDiA Press Release

CEA-Leti News

OSEO

MedTech Insider

Silicon Semiconductor

Photo Courtesy IPDiA

CARTS International 2012

CARTS International brought together technical expertise from around the globe in one integrated conference representing the passive electronic components industry.    Experts shared their expertise and exchanged ideas with their peers and manufacturers.

With more than 40 papers, CARTS International was the place to be for application-oriented technical information – including tutorials, seminars, and provoking insights from a variety of thought leaders.  There was a blend of engineering, design and marketing.  If passive components engineering and applications are your area of responsibility, this is a symposium you should consider.

Keynote presentations were given by:

Keynote and technical presentations at CARTS 2012 were very well attended throughout the event.  Keynote presenters included (and pictured above):

Chuck Richardson from iNEMI  spoke about roadmapping “The Future” and activities from various committees.  He also noted that there is need for others to join and to make sure that there is additional representation in topics across the industry.

Andrew Rassweiler from iSuppli spoke about “The Feasibility” and activities of his firm related to component counts.  He noted the finding that is an increased use of passive components – especially when new features are added and different configurations are offered to consumers.

Dennis Zogbi from Paumanok Publications spoke about “The Facts” and provided market data and trends that generated quite a bit of discussion. Dennis made the case for raw materials being a driving force in component availability in the future.

The full program can be found here.

For more information, and to sign up for CARTS 2013, please contact:

Electronic Components Industry Association
1111 Alderman Drive, Suite 400
Alpharetta, GA 30005
Phone: 678.393.9990
Fax: 678.393.9998
Email